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Mid LevelFull-timeAI
Salary Range
$150,000 - $210,000 /year
About the Role
We are seeking a highly technical MEMS Integration Engineer to bridge the gap between our internal design engineering teams and external foundry partners at nEye.ai, a well-funded optical switch startup revolutionizing data centers.
Key Responsibilities
- →Partner closely with design engineering and fabs to define, develop, and refine process flows for new MEMS products
- →Oversee the end-to-end NPI lifecycle, from process transfer to external foundries
- →Act as the primary technical interface between nEye’s design team and foundry integration engineers
- →Design, document, and execute end-to-end MEMS process flows
- →Develop and maintain rigorous process specifications
- →Lead the development and integration of Through-Silicon Vias (TSVs)
- →Manage Foundry Tape-out activities
- →Monitor Statistical Process Control (SPC) and address Out of Control (OOC) events
- →Analyze metrology data to identify failure modes
- →Track, analyze, and report on key process and device performance metrics
- →Lead Root Cause Analysis (RCA) and 8D reporting for process deviations
- →Drive Continuous Improvement Plans (CIP) to optimize device performance
Requirements
- ✓BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, MEMS, Applied Physics, Materials Science, or related field
- ✓5+ years of hands-on experience in foundry process engineering, MEMS, or CMOS process development
- ✓Proven track record managing tape-outs and taking products through the NPI lifecycle
- ✓Proven track record of architecting and executing successful, end-to-end MEMS process flows
- ✓Deep expertise in Wafer-to-Wafer (W2W) integration
- ✓Experience with Through-Silicon Via (TSV) integration
- ✓Proficiency in SPC methodologies and yield analysis software
- ✓Solid understanding of cleanroom practices
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