Principal Application Engineer – Low-Voltage GaN Discrete & GaN ICs at RenesasElectronics

RenesasElectronics

Shenzhen, cn·10h ago

SeniorFull-timeRust

Salary Range

$53,040 - $71,760 /year

Estimated

This salary is estimated based on similar roles. The actual salary may vary.

About the Role

We are seeking an experienced and visionary Principal Application Engineer specializing in low-voltage GaN discrete devices, GaN power stages, and GaN driver ICs. This senior role emphasizes deep technical leadership in application development, reference designs, customer enablement, and system-level performance optimization for low-voltage GaN power systems.

Key Responsibilities

→Serve as the technical authority for low-voltage GaN discretes and GaN ICs.
→Establish best practices for GaN switching, PCB layout, EMI optimization, thermal management, and reliability.
→Provide system-level guidance across motor drives, robotics, high-current DC-DC converters, and battery-powered platforms.
→Architect and develop low-voltage GaN-based reference designs including motor drives, inverter stages, and DC-DC systems.
→Lead board bring-up, waveform tuning, thermal optimization, EMI validation, and performance benchmarking.
→Collaborate closely with product engineering teams to define and execute validation test plans for low-voltage GaN discretes, GaN power stages, and driver ICs.
→Validate device performance across switching behavior, safe operating limits, thermal characteristics, layout sensitivity, and reliability conditions.
→Act as a trusted advisor to customers by reviewing schematics, layouts, and system architectures.
→Troubleshoot field issues and guide customers on optimizing GaN devices for high-frequency switching and high-power density operation.
→Mentor junior engineers and foster a culture of technical excellence in GaN-based power system design.
→Develop high-quality collateral including application notes, white papers, design guides, and GaN best-practice documentation.
→Collect and relay customer insights on performance, integration challenges, and new feature requirements to influence internal improvements.