Jobs → Engineering → Technical Program Manager

About the Role We are seeking an experienced Technical Program Manager (TPM) specializing in Advanced SoC Physical Design to lead end-to-end SoC implementation programs from RTL handoff through GDSII signoff and tape-out. Key Responsibilities • Lead end-to-end SoC implementation programs from RTL handoff to GDSII signoff and tape-out • Manage program schedules, milestones, resources, delivery commitments, and quality • Coordinate Design, Verification, DFT, Package, CAD, and Silicon Validation teams • Identify technical risks, manage dependencies, resolve issues, and drive mitigation plans • Lead customer communications, stakeholder engagements, status reviews, and escalations • Drive successful full-chip ASIC/SoC implementation and advanced-node silicon tape-outs • Manage large engineering teams, including multi-site and global teams • Support EDA automation, AI-assisted design methodologies, and design-flow optimization Requirements • B.E./B.Tech or M.E./M.Tech in Electronics, Electrical Engineering, Computer Engineering, or a related field • 12–18+ years of semiconductor industry experience • Minimum 5+ years leading SoC implementation programs or full-chip tape-outs • Strong experience in advanced-node physical design and full-chip SoC/ASIC implementation • Proven track record of successful silicon tape-outs at advanced process nodes • Experience managing customer-facing engagements and large engineering delivery teams • Strong program planning, schedule management, risk mitigation, and delivery execution skills • Excellent communication, stakeholder management, problem-solving, and cross-functional coordination skills