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LeadFull-timeAI
Salary Range
$119,340 - $161,460 /year
This salary is estimated based on similar roles. The actual salary may vary.
About the Role
Astera Labs is establishing a strategic R&D center in Israel to develop complex semiconductor chips for AI infrastructure. We are seeking an Expert IC Package Design Lead to build our engineering team and lead the physical implementation strategy for high-performance connectivity silicon.
Key Responsibilities
- →Own end-to-end IC package design from architecture through production
- →Define package architecture and technology selection for advanced solutions
- →Lead signal integrity, power integrity, and thermal considerations
- →Drive package layout, substrate routing, and materials selection
- →Collaborate with silicon design, SerDes, and reliability teams
- →Interface with OSATs and manufacturing partners for DFM
- →Lead risk assessment and failure analysis
- →Support NPI and product sustainment activities
Requirements
- ✓10+ years of hands-on IC package design experience
- ✓Expert proficiency in Cadence APD/SiP or equivalent tools
- ✓Strong package architecture and integration expertise
- ✓Deep understanding of signal, power, and thermal integrity
- ✓Proven manufacturing and release experience
Preferred Qualifications
- ✓Experience with AI, networking, PCIe, or CXL interfaces
- ✓Familiarity with package reliability standards
- ✓Experience with chiplet-based architectures
- ✓Prior technical leadership on high-volume products
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